1. product pro?le 1.1 general description planar maximum ef?ciency general application (mega) schottky barrier recti?ers with an integrated guard ring for stress protection, encapsulated in small and ?at lead surface-mounted device (smd) plastic packages. 1.2 features n forward current: i f 1a n reverse voltage: v r 30 v n very low forward voltage n small and ?at lead smd plastic packages 1.3 applications n low voltage recti?cation n high ef?ciency dc-to-dc conversion n switch mode power supply n reverse polarity protection n low power consumption applications 1.4 quick reference data [1] pulse test: t p 300 m s; d 0.02. PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers rev. 02 22 march 2007 product data sheet table 1. product overview type number package con?guration nxp jeita PMEG3010CEH sod123f - single pmeg3010cej sod323f sc-90 single table 2. quick reference data symbol parameter conditions min typ max unit i f forward current t sp 55 c --1a v r reverse voltage - - 30 v v f forward voltage i f =1a [1] - 450 520 mv
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 2 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 2. pinning information [1] the marking bar indicates the cathode. 3. ordering information 4. marking table 3. pinning pin description simpli?ed outline symbol 1 cathode [1] 2 anode 001aab540 12 sym001 12 table 4. ordering information type number package name description version PMEG3010CEH - plastic surface-mounted package; 2 leads sod123f pmeg3010cej sc-90 plastic surface-mounted package; 2 leads sod323f table 5. marking codes type number marking code PMEG3010CEH c8 pmeg3010cej en
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 3 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . 6. thermal characteristics [1] for schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses p r are a signi?cant part of the total power losses. [2] device mounted on an fr4 pcb, single-sided copper, tin-plated and standard footprint. [3] device mounted on an fr4 pcb, single-sided copper, tin-plated, mounting pad for cathode 1 cm 2 . [4] soldering point of cathode tab. table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit v r reverse voltage - 30 v i f forward current t sp 55 c-1a i frm repetitive peak forward current t p 1 ms; d 0.25 -7a i fsm non-repetitive peak forward current square wave; t p =8ms PMEG3010CEH - 9 a pmeg3010cej - 10 a p tot total power dissipation t amb 25 c PMEG3010CEH [1] - 375 mw [2] - 830 mw pmeg3010cej [1] - 350 mw [2] - 830 mw t j junction temperature - 150 c t amb ambient temperature - 65 +150 c t stg storage temperature - 65 +150 c table 7. thermal characteristics symbol parameter conditions min typ max unit r th(j-a) thermal resistance from junction to ambient in free air [1] PMEG3010CEH [2] - - 330 k/w [3] - - 150 k/w pmeg3010cej [2] - - 350 k/w [3] - - 150 k/w r th(j-sp) thermal resistance from junction to solder point [4] PMEG3010CEH - - 60 k/w pmeg3010cej - - 55 k/w
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 4 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 7. characteristics [1] pulse test: t p 300 m s; d 0.02. table 8. characteristics t amb =25 c unless otherwise speci?ed. symbol parameter conditions min typ max unit v f forward voltage [1] i f = 1 ma - 200 240 mv i f = 10 ma - 260 310 mv i f = 100 ma - 330 390 mv i f = 500 ma - 400 440 mv i f = 700 ma - 420 450 mv i f = 1 a - 450 520 mv i r reverse current v r = 5 v - 1.2 - m a v r =10v - 1.8 - m a v r =30v - 10 50 m a c d diode capacitance v r = 1 v; f = 1 mhz - 90 100 pf
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 5 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers (1) t amb = 150 c (2) t amb = 125 c (3) t amb =85 c (4) t amb =25 c (5) t amb = - 40 c (1) t amb = 150 c (2) t amb = 125 c (3) t amb =85 c (4) t amb =25 c (5) t amb = - 40 c fig 1. forward current as a function of forward voltage; typical values fig 2. reverse current as a function of reverse voltage; typical values f = 1 mhz; t amb =25 c fig 3. diode capacitance as a function of reverse voltage; typical values 006aaa752 v f (v) 0.0 0.6 0.4 0.2 10 1 10 3 10 2 10 4 i f (ma) 10 - 1 (1) (2) (3) (4) (5) 006aaa753 v r (v) 030 20 10 10 - 1 10 - 3 10 - 2 10 3 10 2 10 4 10 1 10 5 i r ( m a) 10 - 4 (1) (2) (3) (4) (5) 006aaa754 v r (v) 030 20 10 80 120 40 160 200 c d (pf) 0
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 6 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 8. test information 9. package outline 10. packing information [1] for further information and the availability of packing methods, see section 14 . fig 4. duty cycle de?nition t 1 t 2 p t 006aaa812 duty cycle d = t 1 t 2 fig 5. package outline sod123f fig 6. package outline sod323f (sc-90) 04-11-29 dimensions in mm 1.2 1.0 0.25 0.10 3.6 3.4 2.7 2.5 0.55 0.35 0.70 0.55 1.7 1.5 1 2 04-09-13 dimensions in mm 0.80 0.65 0.25 0.10 0.5 0.3 2.7 2.3 1.8 1.6 0.40 0.25 1.35 1.15 1 2 table 9. packing methods the indicated -xxx are the last three digits of the 12nc ordering code. [1] type number package description packing quantity 3000 10000 PMEG3010CEH sod123f 4 mm pitch, 8 mm tape and reel -115 -135 pmeg3010cej sod323f
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 7 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 11. soldering re?ow soldering is the only recommended soldering method. dimensions in mm fig 7. re?ow soldering footprint sod123f re?ow soldering is the only recommended soldering method. dimensions in mm fig 8. re?ow soldering footprint sod323f (sc-90) 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ) solder lands solder resist occupied area solder paste 001aab169 1.65 0.50 (2 ) 2.10 1.60 2.80 0.60 3.05 0.50 0.95 solder lands solder resist occupied area solder paste
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 8 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 12. revision history table 10. revision history document id release date data sheet status change notice supersedes PMEG3010CEH_pmeg3010cej_2 20070322 product data sheet - pmeg3010cej_1 modi?cations: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? type number PMEG3010CEH added ? section 1.1 gener al descr iption : amended ? t ab le 1 product o v er vie w : added ? t ab le 7 ther mal char acter istics : t ab le note 1 amended ? t ab le 8 char acter istics : v f forward voltage maximum values amended ? section 8 t est inf or mation : added pmeg3010cej_1 20060411 product data sheet - -
PMEG3010CEH_pmeg3010cej_2 ? nxp b.v. 2007. all rights reserved. product data sheet rev. 02 22 march 2007 9 of 10 nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 13.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 13.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 13.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 14. contact information for additional information, please visit: http://www .nxp.com for sales of?ce addresses, send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors PMEG3010CEH; pmeg3010cej 1 a very low v f mega schottky barrier recti?ers ? nxp b.v. 2007. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 22 march 2007 document identifier: PMEG3010CEH_pmeg3010cej_2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 15. contents 1 product pro?le . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description. . . . . . . . . . . . . . . . . . . . . . 1 1.2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data. . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics. . . . . . . . . . . . . . . . . . . 3 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 packing information. . . . . . . . . . . . . . . . . . . . . . 6 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 13.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 14 contact information. . . . . . . . . . . . . . . . . . . . . . 9 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
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